superchunk said:
Yes, Nintendo will definitely be able to put the hardware I have in my OP in a device based on the sizes found on their WiiU E3 page. (Its relatively same thickness and width... but its a lot longer) Keep in mind there are phones and tablets coming out in a month with quad-core CPUs as well as many existing laptops. Then consider that IBM/AMD and Nintendo will heavily optimize the solution for lowest heat and size factors based on the cost and casing they want to produce. |
Those CPUs will be scaled back versions though and chips in Phones are Arm based which tend to generate less heat. Consoles typically have pretty powerful chips at the time of their release.
Having said that the CPU probably won't be a problem considerring how Intel have managed energy requirements and heat on even the more powerful of the the i3-i7 chips. I still can't believe how small the stock coolers are on these chips. With the GPU being a fairly old architecture (and assuming current die shrinkages) a clever air cooling solution would still be doable... so actually thinking about... I agree