Notice how you originally wrote "on the same die".  Learn the difference between die, and chip carrier. On the image you reference there is the MCM pictured that contains TWO CHIP CARRIERS. One carrier contains GPU/eDram (maybe on same die, maybe not - until someone opens the carrier we won't know). The second chip carrier contains the CPU. Notice this is done to reduce costs, as the small MCM contains more layers than the main pcb (due to the many address and data bus lines). So a manufacturer can significantly reduce costs by having a low-layer-numbers (= low price) main pcb and only a small, high-layer-numbers (=high price) MCM (the same idea is done in the PS3).

Actually this was right about what I expected.

For the most part I took a wait and see approach and participated in the speculation here and there, but I was pretty sure it wouldn't be a graphical beast even by today's standards. This is about Wii level (or possibly above- since we don't have much to go on about future consoles), and like the Wii there's no good reason why potential Wii U games won't look more impressive than the previous generation's experiences.

to add further

its not the speed of the ram, that is the issue, its the bandwidth connection between the components. for instance the MCM of the WiiU has the GPU, the CPU and the Memory's bandwidth all on the same packaged PCB. off chip connection between each component is what the communication speed between each system component is the point that is being made, like say for instance you have off board Edram of certain memory speed but the connection bandwidth  to and from that chip is slower than its native speed its going to only be able to communicate with another system component only as fast as the communication bandwidth memory speed of the connection memory will allow. 

its the connected wire if you will thats the problem, not the memory's base cycle speed., there is still much about the WiiU we do not know about yet and making a blank statement that this bus speed is too slow  for the system its quite a bit too early in my opinion to make such a statement in my opinion because there is still so much about the system we do not know about yet.

Don't be silly. That privileged is reserved for Sony.

. MCM's are SOC's
omg, i know the difference, what do you call a SOC? just because both cores are not direct to each other on say a cpu/gpu set mem package does not mean they are not on the same chip carrier were splitting hairs here in the definition. SOC's are on the same die. which is if you went through the entire break down under the chip spreader it is both chips are on the same die. Now if you want to talk about the connection between both chips that is where were on the same page as far as the speed, but like others have pointed out we have yet to see the lay out of the  connection.s between the chips or its channel of on die connection.

This explains why they only allow 1GB of memory for games. They probably can't really benefit from anything more as they simply cannot access the memory fast enough for it to matter.

720p without MSAA games confirmed for Wii.

 With that slow RAM we will see little game in 1080p or MSAA.

eDRAM alone can't help in this bottleneck.

Samsung K4W4G1646B -> DDR3 4Gbit, 1.5V, 800/933/1066 speed bins -> I'm pretty sure that means "DDR3-1600/1866/2133" data rate."

I'm pretty sure you need to do your research.

20 dollars get the same amount of ram at a faster speed and by faster I mean way faster.

 if I have to open my wii-myself to disprove this I will.

The PCPer opened the Wii U if you want to check.

http://nl.twitch.tv/pcper/b/341042388

PS. That's not fake.

So if the WiiU takes parts of the PS3 and 360 it can be perfect? XD lol.    I did some reaserach in power level and I found this:

Cell without eating people: 9,000,000  (WiiU)

Android 17: 8,000,000 (PS3)

Android 18: 7,500,000 (360)

Seems right lol, I wonder how the PS4 and 720 will be against cell XD

EDIT: PS4 // 720

GOGETA and VEGITTO

both rape cell XD