Wiiu RAM 43% slower than PS360 RAM

[joeorc]

drkohler said:

joeorc said:

drkohler said:

joeorc said:

yes and no, the WiiU's chip is a SOC with all cpu,gpu and edram memory bandwidth all on the same die.

No. the CPU is not on the same chip carrier as the GPU/eDram (as per Nintendo image of the mainboard posted 1-2 weeks ago).

UMM yes it is ..IT IS INDEED A MCM

Notice how you originally wrote "on the same die".  Learn the difference between die, and chip carrier. On the image you reference there is the MCM pictured that contains TWO CHIP CARRIERS. One carrier contains GPU/eDram (maybe on same die, maybe not - until someone opens the carrier we won't know). The second chip carrier contains the CPU. Notice this is done to reduce costs, as the small MCM contains more layers than the main pcb (due to the many address and data bus lines). So a manufacturer can significantly reduce costs by having a low-layer-numbers (= low price) main pcb and only a small, high-layer-numbers (=high price) MCM (the same idea is done in the PS3).

. MCM's are SOC's
omg, i know the difference, what do you call a SOC? just because both cores are not direct to each other on say a cpu/gpu set mem package does not mean they are not on the same chip carrier were splitting hairs here in the definition. SOC's are on the same die. which is if you went through the entire break down under the chip spreader it is both chips are on the same die. Now if you want to talk about the connection between both chips that is where were on the same page as far as the speed, but like others have pointed out we have yet to see the lay out of the  connection.s between the chips or its channel of on die connection.