ethomaz said:
This model K4W4G1646B is 16 bits... at least there aren't 32 bits for end user. |
As stated before, nowhere in the Samsung documentation does it state bus width. The 256Mx16 refers to physical on-die arrangement.
ethomaz said:
This model K4W4G1646B is 16 bits... at least there aren't 32 bits for end user. |
As stated before, nowhere in the Samsung documentation does it state bus width. The 256Mx16 refers to physical on-die arrangement.
Attoyou said:
Lets not get crazy now. should look something like this by end of next gen : 720 = ps4 =
PC =
Wii u =
|
don't underestmate the heart of the cards!!!!
We already know what kind of system the Wii U is, people just can't accept it and look for different answers rather than accepting the answers we have.
Tease.
thewayofthepath said: As stated before, nowhere in the Samsung documentation does it state bus width. The 256Mx16 refers to physical on-die arrangement. |
I know... I just stated all the chips sold by Samsung based in this model is 16 bits... Samsung doesn't produce this model in 32-bit.
One 32bits model is the K4J52324QE for example.
The K4W4G1646B is 16 bits.
drkohler said:
Obviously you don't have the slightest clue of what you are talking about. You bring up buzzwords like "SoC", "Set mem package" (whatever THAT means), "same page" (whatever THAT means), "channel of on die connection" (huh?). Look, the names have a VERY defined meaning. Here is what the WiiU memory system looks like EXACTLY: 1. Four 256MBit *16bit gDDR3 chips, connected to the large MCM. This gives a 64bit wide data bus (exactly what every single memory controller uses in the industry) 2. The MCM contains two chip carriers, a large one and a small one. The small one contains the die of the CPU. A chip carrier is a square ceramic/thermoplast thingie with pins or balls on the underside that connect to a pcb and has "stuff" inside do do "stuff" (I have worked with chip carriers that contained almost a dozen analog/digital circuits). 3. We don't know what is exactly hidden inside the large chip carrier. It contains either a single die (with GPU and eDram), or two dies (one GPU, one eDram). Unless someone pries open the large chip carrier (a specialist can probably do that without killing the WiiU), we don't know. One or two dies, one contains the dram memory controller for the gDDR3 drams (on the picture, you can see the address and data lines going to the large chip carrier). Obviously inside the GPU die, there is a lot of "magic" that handles the further distribution of memory to eDram/CPU/DSP. It is this magic that makes the WiiU powerful, considering the weak CPU/memory bandwidth). 4 What do I call a SoC? Well, SoC is short for "System On a Chip". It is wildly used in advertising for everything small enough that constitutes the "core" of a computer. Sometimes it is used to describe a single die that contains a CPU,GPU and ram. Sometimes it is used to describe a single chip carrier that contains a CPU,GPU and ram. Sometimes it is used to advertise an MCM that contains a CPU,GPU and ram. It is a buzzword, nothing more, nothing less. |
This what I was thinking you can't just look at it from a tears own you need to take it out because there are 4 each being highlycustumized.
look at the wii-u tear down and breakdown from iwata he said the ram was custumly made. To work a certain way.
i feel like the report is one from someone just looking at it with taking everything apart from the actual chip.
"Excuse me sir, I see you have a weapon. Why don't you put it down and let's settle this like gentlemen" ~ max
ninetailschris said: This what I was thinking you can't just look at it from a tear down you need to take it out because there are 4 each being highlycustumized. |
Look into Samsung's data sheets for memories. The gDDR3 rams are off--the shelf chips.
drkohler said:
Look into Samsung's data sheets for memories. The gDDR3 rams are off--the shelf chips. |
It can be altered in terms of clock speeds and latencies.
Baron said:
|
Yeap but Samsung uses another model name for that pourpose.
This specific model (K4W4G1646B) have specifics specs... there are others models with differents specs.
CPU is custom. GPU is custom. WiFi chip is custom. Power supply is custom. DSP is custom.
RAM is what?
The rEVOLution is not being televised
Viper1 said: CPU is custom. GPU is custom. WiFi chip is custom. Power supply is custom. DSP is custom. RAM is what? |
In the RAM chip you can read the specific model name K4W4G1646B... I think it was custom Samsung may give it anoter model name.