Forums - Nintendo Discussion - Wiiu RAM 43% slower than PS360 RAM

thewayofthepath said:
I haven't read all of the posts in this thread, but the 3dforums comment links to a
Samsung pdf file:
http://www.samsung.com/us/business/oem-solutions/pdfs/PSG_1H_2012.pdf

This explains the 256Mx16 as the per chip memory organization. In other words 256 megabits (32 megabytes) in 16 blocks. That means 512 megabytes per chip, and there are four chips on the Wii U PCB. 512 times four equals two gigabytes, exactly as advertised by Nintendo

The Samsung pdf does not mention data bus width. However, it seems the GDDR3 specification implies 32-bit bus per chip. This would mean double the bandwidth as stated in the original post.
http://en.wikipedia.org/wiki/GDDR3

This model K4W4G1646B is 16 bits... at least there aren't 32 bits for end user.



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ethomaz said:
thewayofthepath said:
I haven't read all of the posts in this thread, but the 3dforums comment links to a
Samsung pdf file:
http://www.samsung.com/us/business/oem-solutions/pdfs/PSG_1H_2012.pdf

This explains the 256Mx16 as the per chip memory organization. In other words 256 megabits (32 megabytes) in 16 blocks. That means 512 megabytes per chip, and there are four chips on the Wii U PCB. 512 times four equals two gigabytes, exactly as advertised by Nintendo

The Samsung pdf does not mention data bus width. However, it seems the GDDR3 specification implies 32-bit bus per chip. This would mean double the bandwidth as stated in the original post.
http://en.wikipedia.org/wiki/GDDR3

This model K4W4G1646B is 16 bits... at least there aren't 32 bits for end user.

As stated before, nowhere in the Samsung documentation does it state bus width.  The 256Mx16 refers to physical on-die arrangement.



Attoyou said:
Heavenly_King said:
ethomaz said:

Heavenly_King said:

Seems right lol, I wonder how the PS4 and 720 will be against cell XD

Vegitto pic

yeah I editted my post before reading yours.  I guess they would be different and yet capable of almost the same things.

PS4//720

Gogeta Vegitto

both rape cell

And for the PC fans reading this  I guess PC would be like this:

Goku SSJ4

Lets not get crazy now. 

should look something like this by end of next gen :

720 =

ps4 =

 

PC = 

 

Wii u = 

 


don't underestmate the heart of the cards!!!!



We already know what kind of system the Wii U is, people just can't accept it and look for different answers rather than accepting the answers we have.



Tease.

thewayofthepath said:

As stated before, nowhere in the Samsung documentation does it state bus width.  The 256Mx16 refers to physical on-die arrangement.

I know... I just stated all the chips sold by Samsung based in this model is 16 bits... Samsung doesn't produce this model in 32-bit.

One 32bits model is the K4J52324QE for example.

The K4W4G1646B is 16 bits.

 



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drkohler said:
joeorc said:

. MCM's are SOC's
omg, i know the difference, what do you call a SOC? just because both cores are not direct to each other on say a cpu/gpu set mem package does not mean they are not on the same chip carrier were splitting hairs here in the definition. SOC's are on the same die. which is if you went through the entire break down under the chip spreader it is both chips are on the same die. Now if you want to talk about the connection between both chips that is where were on the same page as far as the speed, but like others have pointed out we have yet to see the lay out of the  connection.s between the chips or its channel of on die connection.

Obviously you don't have the slightest clue of what you are talking about. You bring up buzzwords like "SoC", "Set mem package" (whatever THAT means), "same page" (whatever THAT means), "channel of on die connection" (huh?).

Look, the names have a VERY defined meaning. Here is what the WiiU memory system looks like EXACTLY:

1. Four 256MBit *16bit gDDR3 chips, connected to the large MCM. This gives a 64bit wide data bus (exactly what every single memory controller uses in the industry)

2.  The MCM contains two chip carriers, a large one and a small one. The small one contains the die of the CPU. A chip carrier is a square ceramic/thermoplast thingie with pins or balls on the underside that connect to a pcb and has "stuff" inside do do "stuff" (I have worked with chip carriers that contained almost a dozen analog/digital circuits).

3. We don't know what is exactly hidden inside the large chip carrier. It contains either a single die (with GPU and eDram), or two dies (one GPU, one eDram). Unless someone pries open the large chip carrier (a specialist can probably do that without killing the WiiU), we don't know.  One or two dies, one contains the dram memory controller for the gDDR3 drams (on the picture, you can see the address and data lines going to the large chip carrier). Obviously inside the GPU die, there is a lot of "magic" that handles the further distribution of memory to eDram/CPU/DSP. It is this magic that makes the WiiU powerful, considering the weak CPU/memory bandwidth).

4 What do I call a SoC? Well, SoC is short for "System On a Chip". It is wildly used in advertising for everything small enough that constitutes the "core" of a computer. Sometimes it is used to describe a single die that contains a CPU,GPU and ram. Sometimes it is used to describe a single chip carrier that contains a CPU,GPU and ram. Sometimes it is used to advertise an MCM that contains a CPU,GPU and ram. It is a buzzword, nothing more, nothing less.

This what I was thinking you can't just look at it from a tears own you need to take it out because there are 4 each being highlycustumized.

look at the wii-u tear down and breakdown from iwata he said the ram was custumly made. To work a certain way.

i feel like the report is one from someone just looking at it with taking everything apart from the actual chip.



"Excuse me sir, I see you have a weapon. Why don't you put it down and let's settle this like gentlemen"  ~ max

ninetailschris said:

This what I was thinking you can't just look at it from a tear down you need to take it out because there are 4 each being highlycustumized.

Look into Samsung's data sheets for memories. The gDDR3 rams are off--the shelf chips.



drkohler said:
ninetailschris said:

This what I was thinking you can't just look at it from a tear down you need to take it out because there are 4 each being highlycustumized.

Look into Samsung's data sheets for memories. The gDDR3 rams are off--the shelf chips.


It can be altered in terms of clock speeds and latencies.



Baron said:
drkohler said:
ninetailschris said:

This what I was thinking you can't just look at it from a tear down you need to take it out because there are 4 each being highlycustumized.

Look into Samsung's data sheets for memories. The gDDR3 rams are off--the shelf chips.


It can be altered in terms of clock speeds and latencies.

Yeap but Samsung uses another model name for that pourpose.

This specific model (K4W4G1646B) have specifics specs... there are others models with differents specs.



CPU is custom. GPU is custom. WiFi chip is custom. Power supply is custom. DSP is custom.

RAM is what?



The rEVOLution is not being televised