Vita? Thread title says PSP.

Good suggestion though. Here goes, both native res:

http://www.dmprof.com/english/e_products/e_pica_200/

Tadaa. Surprised I didn't think of that before, checking DMP's website. If 3DSbrew is right about the 3DS's GPU clock core, then it will be achieving around 20M polygons/sec, about the same as the Gamecube I believe.

Still not sure about the CPU. Early reports before the 3DS was released said it was either two ARM11's or a dual core ARM11 at 266Mhz, I've seen other "sources" that say it's higher than that though.

Just ask kaizar
Hes the ultimate spec source

Check a few pages back. I pointed it out, yet everyone continues to ignore it and choose to beleive their in own "sources". I beleive its 2 ARM11 CPU's and not dual-core (sorry I didn't bother correcting myself before).

About the CPU - www.arm.com/products/processors/classic/arm11/index.php?tab=Specifications

ARM11 Processor Family

The 3DS is more powerful than the Gamecube, probably more powerful than the Xbox. The CPU is slower, more than two thirds the speed of the Xbox, but it's got twice as much RAM and the GPU is just about twice as powerful.

On the technical side of things, the PSP is actually more powerful than the PS2. Very very slight. Almost identical, but still more powerful. We've seen more better looking games on the PS2 though, and that might be because not as many games were released on the PSP, but if it got the support, who knows if the PSP would actually have better looking games than the PS2? I think the real problem with the PSP was that it could only hold 1.8GB of data..

3Dbrew, is like going to beyond3D for Wii U specs.

Plus the 3DS has at least 9 MB VRAM and the external storage is Toshiba 2 GB with internal memory of 1.5 GB.

Any proof for the 9 MB VRAM? Perhaps another yahoo-source?

Well, 4 MB of VRAM, but 268 MHz across the board for each core both CPU & GPU is clearly fabricated.

AMR11 CPU (difference from ARM9):

Redesigned pipeline, supporting faster clock speeds (target up to 1 GHz)

PICA200:

Specification:

 65 nm Single Core [7](max. clock frequency 400 MHz) pixel performance: 800 Mpixel/s[7] 400 Mpixel/s @100 MHz[2] 1600 Mpixel/s @400 MHz vertex performance: 15.3 Mpolygon/s[7] 40Mtriangle/s @100 MHz[2] 160Mtriangle/s @400 MHz Power consumption: 0.5-1.0 mW/MHz[2] Frame Buffer max. 4095×4095 pixels Supported pixel formats: RGBA 4-4-4-4, RGB 5-6-5, RGBA 5-5-5-1, RGBA 8-8-8-8 Vertex program (ARB_vertex_program) Render-to-Texture MipMap Bilinear texture filtering Alpha blending Full-scene anti-aliasing (2×2) Polygon offset 8-bit stencil buffer 24-bit depth buffer Single/Double/Triple buffer DMP's MAESTRO-2G technology per pixel lighting procedural texture refraction mapping subdivision primitive shadow gaseous object rendering.

http://en.wikipedia.org/wiki/Nintendo_3DS

I will take it as an explicit "no". Thanks.

ARM11

Differences from ARM9

In terms of instruction set, the ARM11 builds on the preceding ARM9 generation. It incorporates all ARM926EJ-S features and adds the ARMv6 instructions for media support (SIMD) and accelerating IRQ response.

Microarchitecture improvements in ARM11 cores^[2] include:

• SIMD instructions which can double MPEG-4 and audio digital signal processing algorithm speed
• Cache is physically addressed, solving many cache aliasing problems and reducing context switch overhead
• Unaligned and mixed-endian data access is supported
• Reduced heat production and lower overheating risk
• Redesigned pipeline, supporting faster clock speeds (target up to 1 GHz)
  • Longer: 8 (vs 5) stages
  • Out-of-order completion for some operations (e.g. stores)
  • Dynamic branch prediction/folding (like XScale)
  • Cache misses don't block execution of non-dependent instructions
  • Load/store parallelism
  • ALU parallelism
• 64-bit data paths

JTAG debug support (for halting, stepping, breakpoints, and watchpoints) was simplified. The EmbeddedICE module was replaced with an interface which became part of the ARMv7 architecture. The hardware tracing modules (ETM and ETB) are compatible, but updated, versions of those used in the ARM9. In particular, trace semantics were updated to address parallel instruction execution and data transfers.

ARM makes an effort to promote good Verilog coding styles and techniques. This ensures semantically rigorous designs, preserving identical semantics throughout the chip design flow, which included extensive use of formal verification techniques. Without such attention, integrating an ARM11 with third party designs could risk exposing hard-to-find latent bugs. Due to ARM cores being integrated into many different designs, using a variety of logic synthesis tools and chip manufacturing processes, the impact of its register-transfer level (RTL) quality is magnified many times.^[3] The ARM11 generation focused more on synthesis than previous generations, making such concerns be more of an issue.

[edit]Cores

There are four ARM11 cores:

• ARM1136^[4]
• ARM1156, introduced Thumb2 instructions
• ARM1176, introduced security extensions^[5]
• ARM11MPcore, introduced multicore support

PICA200

Specification

• 65 nm Single Core ^[7](max. clock frequency 400 MHz)
  • pixel performance: 800 Mpixel/s^[7]
    • 400 Mpixel/s @100 MHz^[2]
    • 1600 Mpixel/s @400 MHz
  • vertex performance: 15.3 Mpolygon/s^[7]
    • 40Mtriangle/s @100 MHz^[2]
    • 160Mtriangle/s @400 MHz
• Power consumption: 0.5-1.0 mW/MHz^[2]
• Frame Buffer max. 4095×4095 pixels
• Supported pixel formats: RGBA 4-4-4-4, RGB 5-6-5, RGBA 5-5-5-1, RGBA 8-8-8-8
• Vertex program (ARB_vertex_program)
• Render-to-Texture
• MipMap
• Bilinear texture filtering
• Alpha blending
• Full-scene anti-aliasing (2×2)
• Polygon offset
• 8-bit stencil buffer
• 24-bit depth buffer
• Single/Double/Triple buffer
• DMP's MAESTRO-2G technology
  • per pixel lighting
  • procedural texture
  • refraction mapping
  • subdivision primitive
  • shadow
  • gaseous object rendering