the larger problem here i see is history, specifically with PPC linage chips, die shrinks/chip mods (most of the rumors about size reduction require this) never go smoothly, and always for about 6 months have higher fial rates per fab, and unexpected increase in thermal leak... always
the last time there was a shortage of 360s coincides with the last switch they did, and i would not be surprised if that happens again. PPC4XX series did the PPC750 series did PPC970 did POWER 1-6 has, both IBM and Freescale/Motorolla have had this problem.
the only way i see around this is if Sony has been being solve is if sony has been making these things since last winter but if they have there should have been alot more loss in the wireless department.
who knows though maybe this will be the first time ever a pp chip does not have problems with a fab change but i doubt it.
note (i am a ppc fanboy it is far better then X86 im my opinion, i still have posters up in my house of the pentium II on the slug and the flaming dancing pentium 2 fab guy... this is however a very long running problem with PPC .... its still more powerful and more efficient chip architecture though )
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