| bdbdbd said: @theRepublic: I do know that the different mixtures conduct heat differently, which of course is pretty irrelevant in this case. The bolded was there to remind that the heatsink wouldn't need to perform much better that it currently does. Now, i don't disagree with geometry being the most important thing, since most efficient (aswell as the most cost efficient) way to cool something, is to remove the heat as fast as possible. Basically adding mass is a way to make the heatsink to reserve more energy, which basically means extended period of time before the heatsink reaches a temperature where natural airflow isn't enough. But, it also makes the fins work more efficiently, since the mass allows the heat to spread more evenly in the fins. Mass is irrevant in the design phase, since it's when you have the design the heatsink accordingly. When you need to "repair" the heatsink design with limited space, mass usually comes more relevant. |
You don't want the heatsink to retain heat. You want it to exhange it with the environment. In this case, the only option is natural convection with air. We don't ever want the chipset to overheat, so we design from steady-state at the maximum allowable temperature.
R = (Tmax-Tout)/Q
Where R is the thermal resistance of the system, Tmax is the maximum allowable temperature of the chip package, Tout is the highest expected ambient temperature, and Q is the heat output of the system. R is your only unknown, and is your design variable. Using the above equation, the maximum allowable thermal resistance can be determined, and then the system can be design to be below that resistance.
Thermal resistance, R, is going to be the sum of several different things, but as it relates to the heat sink, it is a function of fin effeciency (which is a function of geometry), surface area, and heat transfer coefficent (which is a function of fluid flow and characteristics). Mass is not a design variable to be considered, even in a redesign. Space requirement do need to be considered in this redisign since those have already been set.
You mentioned increasing the mass increases the effiecency of the fins, but increasing the thickness of the base (which is what I think you meant) will actually increase the overall thermal resistance of the heat exchanger.
Now that I'm thinking more about this, I wounder how this is going to work since bouyancy and gravity become important for natural convection. It would still need to work for both the upright and flat Wii configurations.
Edit: Besides the fact that mass does not appear in any of the relavent equations for heatsinks, there is another way to look at this. If mass was important, then denser materials would be used, since they have more mass per unit volume.
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