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Hiku said:
BraLoD said:

Yeah, the heatsink was massive, but the Slim is very likely coming with an apu redesign, maybe even phasing out the liquid metal as well, that should be the major point of doing it.

And we would probably be getting rumors of that smaller apu already if that would be getting released in around 3 months from now.

I doubt we will see the Slim release this year, but who knows.

What would be the real estate benefit of not having liquid metal? Wouldn't they need another fan instead, which takes up more space?

And Microsoft's comment is the main reason I am hoping for a Slim this year. Pretty weird that they would be that specific about the price and date if they don't know something.

As for PS5's look, I really disliked it the first time I saw it. Now I think it looks fine, if it wasn't so huge that is.
So a smaller version could be perfect.

Kinda like those bootleg PS5's from Aliexpress.

Liquid metal is likely a bit more expensive than thermal paste, and I think the process to assemble it should be quite different, considering the extra layers of protection the apu needs because of that, which can become a few millions in savings.

I dunno if they would actually need another fan, even as liquid metal is better than thermal paste it should not make that much difference in final temps. I think there are some videos out there with people using thermal paste and it working just fine, just a bit hotter.