KBG29 said:
Please explain, because that goes against everything I have read about the reason AMD, Intel, and Nvidia are all moving towards Chiplets for all consumer and enterprise CPUs and GPUs, and away from Monolithic chips. Cost and Yeilds were the main factors AMD spoke about when they revealed the where seperating the I/O from the main CPU die, why they have been investing heavily into Infinity Fabric, and why they are not throwing 16 or 32 cores on one massive die. Apple has also been doing the same thing, adding more and more fixed function chips to aid the CPU and GPU, instead of throwing more silicone into a single monolithic chips. |
A Zen 2, 8 core CPU chiplet is about 76mm2 and the Radeon 5700 GPU die is about 251mm2, where the XBSX APU is about 360mm2. The XBSX APU would be close to 5X the size of the CPU chiplet and 1.5X as big as the GPU die, though with semi custom modifications that would differ somewhat. Either way SNY should end up with considerably more usable silicon overall, which could very well keep the price down. It may also be part of the reason why they can crank the GPU clocks so high. If the dies are separated on the same interposer, or completely separate on the mobo, that would also help with heat dispersion. I would also think this should make the PS5 upgrade version(s) down the road simpler and cheaper for SNY.
PS1 - ! - We must build a console that can alert our enemies.
PS2 - @- We must build a console that offers online living room gaming.
PS3 - #- We must build a console that’s powerful, social, costs and does everything.
PS4 - $- We must build a console that’s affordable, charges for services, and pumps out exclusives.
PRO -%-We must build a console that's VR ready, checkerboard upscales, and sells but a fraction of the money printer.
PS5 - ^ -We must build a console that’s a generational cross product, with RT lighting, and price hiking.
PRO -&- We must build a console that Super Res upscales and continues the cost increases.







