DJEVOLVE said:
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Aye but there's the rub: the solder was meant to hold together components that generate heat. Better cooling wouldn't actually help the problem because heat goes through the solder before it reaches the fan. Thats why newer models had less chance of RROD with either same fan, in the case of the S models, or what ever the second revision 360 were called, and in the slim models ith smaller fans because they used higher grade heat resistant solder.
In fact, overheating has been blown out of proportion for consoles.
In this day and age, with the Internet, ignorance is a choice! And they're still choosing Ignorance! - Dr. Filthy Frank









