we will have a slim ps3 by end 2009 after all.

when both cpu and gpu go 45nm or 32nm

The Cell is also already at 45nm isn't it?

ugh... no, no and no again.. that's 0 out of 3.

nm basically tells you something about the minimum structure size (or simply said how close you can put one element to another one). The chip does not get thinner at all and does not dissipate heat faster at all. Dissipating heat is a problem of energy density and heat conduction of your cooling solution. (The heat problem is a problem which most people get wrong, actually. A die shrink usually let's you clock the chip higher, or saves, say, 25% of current/voltage if you keep the clock the same. In the end, you generate less heat overall, but _on a much smaller active chip surface_, therefore the energy density actually goes up and requires a _better_ cooling, not a cheaper cooling!

The chip (carrier) doesn't get smaller at all, only the die size is reduced by about 30%. Material costs is the wrong name for it, as the material cost (silicon wafer) itself is irrelevant, the number of dies per waver increases greatly which does lead to reduced chip prices, eventually.

Cheaper and more effective production. We are on the road to Sony losing less money (leading to price drop). Hehe. It's great in any case.

Great News, I think the Japanese would go crazy for a Slim PS3@$299(Yen Equivalent) with Final Fantasy XIII and Final Fantasy Versus XIII

^Hah, yes. By 2009 it's possible.

its just on a smaller surface where the heat is at start so fast heat transport is getting more and more important,  but with heatspreaders directly mounted on the chips packaging and modern cooler technology with heatpipes you can move the energy away fast from the die and overall its less heat so you can use a smaller heatsink.

i will buy my 80gb for the new 160 gb hope it has the same 65nm

45nm? I thought this was coming this year for the PS3?