drkohler said:
ugh... no, no and no again.. that's 0 out of 3. nm basically tells you something about the minimum structure size (or simply said how close you can put one element to another one). The chip does not get thinner at all and does not dissipate heat faster at all. Dissipating heat is a problem of energy density and heat conduction of your cooling solution. (The heat problem is a problem which most people get wrong, actually. A die shrink usually let's you clock the chip higher, or saves, say, 25% of current/voltage if you keep the clock the same. In the end, you generate less heat overall, but _on a much smaller active chip surface_, therefore the energy density actually goes up and requires a _better_ cooling, not a cheaper cooling! |
its just on a smaller surface where the heat is at start so fast heat transport is getting more and more important, but with heatspreaders directly mounted on the chips packaging and modern cooler technology with heatpipes you can move the energy away fast from the die and overall its less heat so you can use a smaller heatsink.
