Well I found this article and thought it was interesting...  http://www.crn.com/hardware/208801780

It basically says:

Intel sees a "clear way" to manufacturing chips under 10 nanometers and when the semiconductor industry transitions to 450mm silicon wafers around 2012, the number of companies that run their own fabs will drop into the single digits.

Intel debuted its 45nm process late last year and has been ramping its Penryn line of 45nm processors steadily throughout this year. The next die shrink milestone will be the 32nm process, set to kick off next year, followed by 14nm a few years after that and then sub-10nm, if all goes according to plan

So I was wondering if the next generation of consoles are expected by 2011, what possible size of chips could they use at launch? I think they'll all use 14nm chips.

The next Nintendo console will not double the PS3 in power and graphics, but I'm pretty sure Nintendo will still be leading the innovation.

Sony and MS won't try to push the limits this time in terms of hardware, of course graphics will be great, much better than current best PC games graphics, but the consoles would still have to be profitable and with a maximum price of 399$ (maybe less if the dollar regains some strenght)

Since co-op and party games are becoming more and more popular I predict that at least one of the consoles will be sold with 2 controllers, some will call me crazy because accesories are one of the best ways for manufacturers to make some profit, but I think it's a terrific idea.

Motion control will be a norm next generation, although current controllers will be compatible with next gen consoles. All three manufacturers could integrate a microphone to the controllers.

Any other prediction or idea that could improve the gaming experience?

I think you're crazy about the 2 controllers
Nintendo will repeat what they did with Wii Play

Intel Predicts
45 nm 2008
32 nm 2009
14 nm a few years later (2012)
10 nm 2013

I believe they will all start out using 32nm chips, and shrink them to 14 nm during the generation

Does anyone know what IBM's road map is for die shrinks? That will probably give a better indicator of how small of a process we will see at launch. I think all 3 manufatures will hop on the BC train with hardware instead of software emulation this time around and scale their current architectures and that means more powerpc based cpus.

I also think everyone will have a hard drive standard for all skus possibly solid state if cheap enough by then. I hope there will be fewer skus as well but i'm not holding my breath on that one.

you missed the general trend downward. Well at least Intel did it seems. IBM stated the following a while ago.

45

32

25

14

11

If i remember right someone said dyes under 11nm is impossible or we will need to ways to manufacture for dyes under 11nm.