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Does anyone know what IBM's road map is for die shrinks? That will probably give a better indicator of how small of a process we will see at launch. I think all 3 manufatures will hop on the BC train with hardware instead of software emulation this time around and scale their current architectures and that means more powerpc based cpus.

I also think everyone will have a hard drive standard for all skus possibly solid state if cheap enough by then. I hope there will be fewer skus as well but i'm not holding my breath on that one.