drkohler on 09 September 2020
| Captain_Yuri said: Final Specs https://news.xbox.com/en-us/2020/09/09/introducing-xbox-series-s/ |
I'm a little puzzled by the fan-out image of the box.
One can see 4 memory chips on the top layer.
The bottom shield has 1 "bump", that is for 1 memory chip (used for thermal contact and pressing the ram chip to the board).
So this would mean:
3 2GB gddr6 chips full width, 2 2GB gddr6 chips in Clamshell mode.
/edit No longer puzzled. Corrected my wrong fst guess
Last edited by drkohler - on 09 September 2020
