Sony might be useing 3D stacked chips to be more power effecient, have better cooling.

[Immersiveunreality]

Pemalite said:

Immersiveunreality said:

If it is a ''special sauce'' or not remains to be seen when it's actually used and thoroughly tested after release to determine whether or not it makes a proportionate enough difference to be considered that,it could be a good evolution for PS hardware.(there are probably not even certain comparisons to be made in order to refute those being ''overly'' optimistic about it)

Bolded:The team behind this hardware most likely know it a lot better than assumingly most if not all the users on this site and it would be unlike them to not be considering those aspects in this new project.

The capabilities of Sony's engineers aren't in question.
But there is a reason why we have only done cooling a certain way for decades.

I'm sure there is but maybe the innovation can lie within a more efficient way to implement it,but we are discussing ghosts at the moment so it might be just best to see what they bring.