Sony might be useing 3D stacked chips to be more power effecient, have better cooling.

[xl-klaudkil]

Moren said:

JRPGfan said:

Sarcasm I take it?... but how many other consumer products do you know that use it currently? Do you see other CPU or GPU solutions that do so?
How many other products do you see a 3D stacked chip cooled on both side? I've never seen that before.

Implying that somehow Microsoft's design wasn't "planned" or innovative is a pretty bold claim, considering they've talked extensively about how they'll handle cooling - they're just going for intricate mechanical designs, which are time-tested and effective.

https://twitter.com/xbox/status/1239522130196193285?lang=en

https://www.youtube.com/watch?v=7Fjn4GRw8qE

Ofcourse because the top of the xbox series x is open for air,so much dust is going to be collected i suspect where going to see a lot of broken systems.

Or not.