| fatslob-:O said: It's alright but AMD would have a more compelling product in their hands for gamers if they didn't have an external I/O die and did some more circuit layout topology optimizations to improve the frequency ... |
Well, that external I/O die serves a dual purpose: It allows to turn the CPUs into mass-produced CPU chiplets that can be used in a multitude of products without needing tons of different masks and for AMD to keep it's obligation with Globalfoundries in terms of minimum wafers they have to buy from them.
Besides, for an external I/O chip, the latencies are quite good.
I agree on the frequency, but I think the IPC was their priority, as it should be. Increased clock speeds will probably come with future chips.
I'm interested to see what Zen2 will do in Laptops and APUs early next year, and how they implement these. Will they keep the chiplet designs or go for a more monolithic design? And how will it fare against the newly announced Ice Lake chips there?
The Nintendo eShop rating Thread: http://gamrconnect.vgchartz.com/thread.php?id=237454 List as Google Doc: https://docs.google.com/spreadsheets/d/1aW2hXQT1TheElVS7z-F3pP-7nbqdrDqWNTxl6JoJWBY/edit?usp=sharing
The Steam/GOG key gifting thread: https://gamrconnect.vgchartz.com/thread/242024/the-steamgog-key-gifting-thread/1/
Free Pc Games thread: https://gamrconnect.vgchartz.com/thread/248138/free-pc-games/1/
