| Bofferbrauer said:
About the chip, I tought you where talking about the one of the Wii U (whose chip is still produced in 45nm) when talking about lowering costs, my bad. I do know that the GTX 970 is made in 28 nm. I am however not sure if 28nm will stay cheapest for as long as you think. First rumors about an Radeon 390 (X) being made in 20nm are starting to arrive, meaning that finally someone seems to have gotten the 20nm production under control (probably TMSC, maybe GloFo). IF thats true then 20 nm might not be that far away after all. And there is another way to reduce costs, but that one is a bit special: bigger wafers. Fabs use 300mm today and 450mm wafers have already been developed, but not yet put into action (and will probably only come after 14/16nm and FinFETs are also implemented due to high initial investments). The cost reduction is however less pronounced than one due to a Die shrink |
28nm prcoess node WILL stay as being the cheapest node until next generation lithography and multipatterning technologies like EUV or DSA arrive but that won't happen for a very long time.
Yes, production of 20nm wafers are going by but it WON'T reduce costs compared to 28nm cause of the fact that multipatterning is required and that drives up the costs of wafers exponentially due to the fact that extra masks are required for the exposure step in lithography.
The development of 450mm wafers have been HALTED and the gains are questionable for the most part. There maybe some saving when multipatterning is involved however there's absolutely no savings with respect to the light exposure. The costs of replacing tools to suit the production of 450mm wafers are also very high so in the end it may not even be worth it ...







