By using this site, you agree to our Privacy Policy and our Terms of Use. Close
Pemalite said:
fatslob-:O said:

Chip area scaling always remains constant for the said manufacturing technology. It is the chip designers themselves that make the choice on how densely packed they want their chips to be. 

Not exactly.
For instance, finFET can assist with density by roughly 15%.
Chip designers can do their own optimisations too, by choosing the best transister for a particular job.

Actually FinFET isn't related to chip area scaling at ALL. It's just a different transistor technology. The reason why we made our move to FinFETs in the first place is because planar MOFSET technology wasn't going to scale well in performance when moving down to below 20nm. When TSMC makes their first move to FinFET they will have no chip area scaling to go with it.

If your wondering why globalfoundries and samsung has a 15% advantage in chip area scaling when making the move to FinFET compared to TSMC's 20/16nm process node it is because samsung has applied more work to the contact pitch in order to increase density.