By using this site, you agree to our Privacy Policy and our Terms of Use. Close
Pemalite said:
medellingamer said:

The wiiu uses a 45 process node confirmed by chip works http://chipworksrealchips.blogspot.com/2014/02/intels-e-dram-shows-up-in-wild.html?m=1   they compare wiiu edram vs 360 edram and give out die sizes.

The problem is however is that over-time a fabrication process matures, it becomes cheaper to produce.
Another side effect is they have a better understanding of a nodes particular electrical properties. (I.E. Leakage and such.)
Which can assist in lowering power consumption and thus TDP.

Converesly something built at 40nm can actually be a larger chip than something built at 45nm even with the same transister counts as different fabs have different transister densities and as a process matures they can more densley pack transisters. (However, nothing on the same level as what an entirely smaller process can provide.)

Thus a 45nm processor built today could have far more transisters than one built a few years ago at 45nm and still use less power and taking up the same amount of space.

This makes comparing different generations of processors even built on the same process a very difficult affair in the best of circumstances.

Chip area scaling always remains constant for the said manufacturing technology. It is the chip designers themselves that make the choice on how densely packed they want their chips to be.