Demensha said:
brendude13 said:
Gamecube said:
brendude13 said: That's good news, but Microsoft shouldn't feel too pressured. Don't want another RROD. |
RRod had more to to with solder failure than chip failure.
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Solder failure because of heat?
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You know how hot that chip would have to be in order to melt the solder? It was more or less the amount/process of how it was built than heat.
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"The main design flaw was the excessive heat on the GPU warping the mother board around it. This would stress the solder joints on the GPU and any bad joints would then fail in early life."
Taken from earlier in the thread. Makes sense really.