Chris Hu on 04 June 2013
Its fugly and bulgy but most of that extra bulge is there to prevent any overheating/RROD disaster. The first redesign will probably make it a lot smaller especially if the skip the 22nm chipset process and make their first redesign using 14nm chips which will probably be cost effective and widely available in late 2015. Another minor thing that bothers me about the design is that the camera lens on the Kincet 2.0 is not in the center.
