Kynes said:
Those passively cooled 5570's need good airflow inside a not too small case. When you are working with convective heat transfer, you need somewhere to place the energy these chips dissipate. If you don't have good airflow, your card burns. Yo can find >100C temperatures in reviews, imagine that in a very small form factor as the WiiU |
Good airflow has nothing to do with form factor. Good airflow means getting enough cool air across the hardware that needs cooling. You're talking about in case heat build-up. Laptops are smaller than the Wii U will ever be and have less ventilation. They don't fry themselves either. And before you begin with how low laptop TDP is, the lowest TDP of any mobile ivy bridge cpu is 17 Watts. If you take a reasonable mobile processor with a reasonable mobile gpu, the combined TDP is already higher than what you think is the limit of the Wii U's small form factor. Yet those components are frequently fitted in 13" laptops without problems of overheating.
And that review has nothing to do with what will be possible in the Wii U. Notice they say the heatsink of the 5570 is the reason why the gpu hits 100+ C.
The Wii U GPU will be custom built, thinks like an insufficient heatsink won't make it past the testing fase.
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Kynes said: Done with 45 nm tech. Chips done with the same fabrication technology, with the same power envelope, can't be several times faster than other chips unless there is a big design flaw. We supposedly have here a WiiU console with a smaller power envelope than X360 and PS3, but several times faster... I'm sure that MS and Sony Engineers aren't retarded. |
The 360 and PS3 are based on 7 year old technology, you'd have to be an utter moron to think today's technology can't deliver more power with a smaller power envelope. Like I proved already the 5570 has a TDP of 39 Watt, the 2600 XT a TDP of 50 Watt. Yet the 5570 is mutliple times faster.







