sethnintendo said:
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They did several revisions but the Jasper did resolve the issues for the old motherboard layout and of course the Slim maintained this reliability with the new layout. You can of course still get RROD with a Jasper board but the actual RROD is a general fault code for the 360 and only the secondary code can tell you if it is the old favourite "0102".
I think Microsoft did consider increasing the board thickness in the 360 but realised it would cause possible issues with timing so they decided to reduce the heat through die shrinks to the CPU and GPU to stop the board warping through heat exchange. They obviously also tried the quick and dirty fixes of gluing chips to the board and changing the xclamp tension so as not to provide as much pressure on the board. I believe the Falcon HDMI chassis altered the board fixing heights to minimize board flex, it also introduced improved heatsinks. They literally tried everything to make up for the systemic fault introduced by the fact their design spec was finalized before the lead free solder legislation. I honestly don't think they knew exactly what the issue was until 12 months after release and then they were firefighting looking for a resolution.
People ask if Microsoft could have been handled RROD better, in my opinion once they knew the scale of the problem they delayed until they knew precisely the ramifications of what they'd done and that they could finance the cost of the mistake. I think they handled it as well as can be expected given it was unprecedented. This of course is no excuse and people who were out of pocket thanks to Microsoft, have every right to be angry and I would probably have taken legal action under the Sales of Goods act in the UK had I been affected.







