| fillet said:
It's not speculation. |
Yea I am aware of solder considering I used to be a BGA and ECN tech at Flextronics. Apparently, they didn't run enough "real world" test to see that the PCB bends. There were obvious design flaws in the first generation of 360s that they finally fixed. Didn't the Jasper chips pretty much eliminate the RROD or drastically reduce it once they came out?







