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zero129 said:

Your right i seemed to of missed that last one, but it still doesn't change my post at all as it only adds one extra card within the range of what it could be.

Now lets compare the specs again using the 4730

Now as you can see the is still no huge difference and the rumored PS4 GPU still doesn't have a big advantage.

Now why i think they would be insane to go with the 4730 instead of one of the 48xx cards.

First if you notice the power consumption, it is more then both the 4850 and the 4830 with no extra benefits. Now i know i said they could cut down the power consumption in a custom card, but wouldn't it be wiser to take a more powerful card such as the 4830 or the 4850 that already have lower power consumption then work with a weaker card?, plus the prices for the 3 cards are pretty much the same.

That's why i am 100% sure if the rumors a true that the Wii U will be using a card in the 48xx range, as it would be insane otherwise.

And to what you said that it "it could be even weaker than the 4730 for all we know.". It could also be more powerful.

But moving on, no matter what way you look at it, judging from the rumored specs the is not going to be a big power difference with the Wii U and the PS4.

But that's only if the rumors hold true, but atm we can only base it on the rumored specs and that's how its looking.


You are forgetting that the Orbis rumours state 2 GPUs not one. 

And the reason they may go for an even "weaker" GPU is that the Wii U is very small and the RV770 is not the most effeciant architecture arround, performance per watt isn't that great, even the 40nm revision the RV740 isn't great it that regard. And the Wii U is a very small console, they are just not going to put a large, hot, power hungry card in a box that small. In fact I don't see them using a card with a TDP of more than 50W TBH, it's 1/3 the size of a 360 slim and the Xenos was 60 watts before the die shrinks and you know the problems they had with heat. There is just no way they can put a RV770 bassed GPU that powerful in a box that small, it is physically impossible without going for a 28nm chip which Nintendo won't do because yeilds would be to low, nintendo always go for a step back from the latest die shrink to maximise yeilds and reliability so it will be a 40nm chip.

Now if they went with a cut down Cape Verde varde variant at 28nm they may be able to get a chip that powerful at a low enough TDP but they are just not going to do that. 



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