D_Boy said: Well well....so we are nearly down to the pico process....1000pm=1nm |
As the article says, pico processes are not gonna happen with silicon-based circuits:
This is where things get a bit weird as materials stop dancing to the rules of classical physics and Schrödinger's wave-equation pops up. Basically, it gets hard to stop the electrons breaching a barrier that's only a few nanometres thick no matter what material you use. This is also at the edge of commercial fabrication, nothing can currently be consistently and reliably made this small.
Toshiba has built a prototype memory module with 15nm lines, but such sizes are still lab experiments. Next stop on the ladder down is the 11nm process, predicted for 2022 by the ITRS, although, again, Intel is more buoyant and talks of 2015.
This is the expected limit of CMOS and may well mean silicon chips are no longer silicon. At this level dielectric thickness could be down to one atom, making it difficult to keep anything going where you want it to go.