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The PS5 Exists.

But PS4 is already slim....
Another model will probably go along with a process shrink.

| ICStats said: But PS4 is already slim.... Another model will probably go along with a process shrink. |
Yeah, I know it's already slim. It just strikes me as a good way of spurring sales and at the moment they don't need to. That's why I'm wondering if they actually sit on the slimmer designs and release them when they need to. It makes sense to me.
The PS5 Exists.

I don't think anyone would release a slim model this early. It's barely a year old. I think Fall 2016 is when we should expect a slim simply because that's the normal time frame and their system is already very sleek and well made so there's no reason for it right now whereas PS3 was pretty fat and heavy when it released.
In all likelihood they surely had it all lined up before PS4 even came out, slim and super slim give or take expected dates of release how much the savings would be yadda yadda.
No they would break, they arent designed to hold that much weight.
| platformmaster918 said: I don't think anyone would release a slim model this early. It's barely a year old. I think Fall 2016 is when we should expect a slim simply because that's the normal time frame and their system is already very sleek and well made so there's no reason for it right now whereas PS3 was pretty fat and heavy when it released. |
I'm not suggesting it's going to release soon, I'm asking the question: Do they sit on the slim redesigns.
The PS5 Exists.

Hit the breaks. It's only been one year. Don't slim models appear earliest after 2 years?
If you demand respect or gratitude for your volunteer work, you're doing volunteering wrong.
Holiday 2015 is the earliest we would see a slim redesign.
SCE will follow the same formula they have since the PS1. There will be internal changes to simplify the logic board, reducing the BoM per unit, there will be logic board redesigns utilizing smaller dies for the SoC/CPU/GPU which increase the processor yield per silicon wafer, reducing the price per chip while simultaneously reducing the power consumption, thermal footprint and cooling system. This is followed by a smaller logic board.
Lastly, designers will design a new housing that the marketing department can advertise as a new model.
There are a lot of incremental changes made before installing everything into a new plastic enclosure.
Priority one is always cost reduction. The repackaging is a marketing move to encourage new sales.
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