(Reads rumored specs)

*sigh*

Seems that I'll buy (at least) 2 consoles again this gen, like if I had enough time to play videogames!

Btw, ~200W for the nextbox! I hope they manage a really good cooling solution without the need of jet turbines instead of fans.

More from AMD China guy...

http://club.tgfcer.com/viewthread.ph...14#pid15719863

"The #2 AMD china guy also mention nextbox will be little better,but both will likely release at 2014
 And he said don't need to care Wii U(performance)"

http://club.tgfcer.com/thread-6593085-1-1.html

"Btw #1 AMD china guy open a new thread
He ask people why think APU=weak,and if AMD want we can make a 7970+8 core CPU in 1 APU,but will come with:heat,yield and size issue,that's why Durango delayed(don't worry(yet) he did not said delayed to 2014,maybe 2012->2013)
He also don't understand why MS so obstinate to make it in 1 APU"

2014 is the year... make happen Sony and Microsoft... not 2013 please.

More AMD China guy...

 http://club.tgfcer.com/viewthread.php?tid=6593085&page=2#pid15931245

"He said Durango APU will be 384bit"

The HD 8900 is suposed to have a 384bits bus width (89 GB/sec @ 1.8Ghz DDR3 to 154 GB/sec @ 3.2Ghz DDR4)... and seems like 6GB RAM (12x 4Gb chips).

Maybe it's because, like Nintendo, they know that it's easier to manage the heat if it comes from 1 single place rather than having 2 heat fonts.

But that makes me ask, the "china guy 1" claims that the nextbox will use 285W (probably the power brick), so the console will use about 200W. Now the same guy says that Msoft wants the CPU and GPU all in 1 APU. Does it mean that the nextbox will have a single chip that uses  ~150W?

How are they goingto cool that thing in a console sized box?

Well an APU with HD 8900 will use a lot of power for sure... and I expect a good cooling system too because the heat will be huge too.

It's not a single chip with little things... it's a single chip with huge things... that will be huge too.

lol I used huge a lot

Damn, when 89xx become a viable candidate? Sure it's not 89xxm?

Well that all rumors but we have 720 with a APU + HD8900 and the PS4 with APU + 7600 + 8800M... so I think that can happen.... the powers seems similar.

That's my huge concern.

They would need a case bigger than usual, go with something like a closed liquid cooler like the Corsair ones (or the AMD one), use some noisy Scythe Kaze fans or more than 1 of those options combined.

HD89xx? Not HD88xx (which translates to 89xxm)? I can potentialy see HD8850 inside, but 89xx (as successor to 79xx) is probably gonna be around same 200-250W TDP.

The rumors is 285W for the chip (APU + GPU).