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Forums - Nintendo Discussion - Nintendo Leak Codename: Fusion DS and Termnial

http://spong.com/article/31220/Nintendo-Next-Gen-Specs-Leaked

 

And so these specs and more have emerged in not one but two units called Nintendo Fusion DS and Terminal. Yes, that was the name of the Nintendo lead rock tour in the 2000s. So, what are those specs? 

FUSION DS

CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
>2 130 mm DVGA (960 x 640) Capacitive Touchscreen
>Slide Out Design with Custom Swivel Tilt Hinge
>Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
>Low End Vibration for Gameplay and App Alerts
>2 Motorized Circle Pads for Haptic Feedback
>Thumbprint Security Scanner with Pulse Sensing Feedback
>2 1mp Stereoptic Cameras
>Multi-Array Microphone
>A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
>3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
>NFC Reader
>3G Chip with GPS Location
>Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
>16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
>Nintendo 3DS Cart Slot
>SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
>Mini USB I/O
>3300 mAh Li-Ion battery

FUSION TERMINAL

GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
>802.11 b/g/n Wireless
>Bluetooth v4.0 BLE
>2 USB 3.0
>1 Coaxial Cable Input
>1 CableCARD Slot
>4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
>Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
>1 HDMI 2.0 1080p/4K Port
>Dolby TrueHD 5.1 or 7.1 Surround Sound
>Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
>Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.

Those come from Gaminrealm, which also quotes one unnamed source stating - in an incredibly garbled manner: 

"“Nintendo has already begin making demo software for the targeted prototype hardware in efforts to curb the Wii U mistake in the software pipeline (they started creating software after prototyping and were unable to give major software push the first two years as a result). Nintendo plans to make most of the software prototypes into games and applications around the launch of the unit.”



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— 

Here a little quote I want for those to keep memorize in your head for this coming next gen.                            

 By: Suke

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Terminal, because that's what the WiiU is ;)

Looking at the rumours is Adreno 420 what they use in the current Samsung Galaxy S4 or is it the one earmarked for the S5?

Either way sounds respectable assuming it's due in say 2016

Also it seems this is basically using a next-gen DS as a potential controller for the new home console, hence fusion. Makes sense, don't know if it's actually any different to the Gamepad in functionality though. Also it seems they've also moved to a more PC-like architecture, seems they have been listening after all

EDIT: Also no 3D? Could lead to a nice increase in the available power for games on the handheld

EDIT2: Answered my own question on the Adreno thing :)



Suke said:

http://spong.com/article/31220/Nintendo-Next-Gen-Specs-Leaked

 

And so these specs and more have emerged in not one but two units called Nintendo Fusion DS and Terminal. Yes, that was the name of the Nintendo lead rock tour in the 2000s. So, what are those specs? 

FUSION DS

CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
>2 130 mm DVGA (960 x 640) Capacitive Touchscreen
>Slide Out Design with Custom Swivel Tilt Hinge
>Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
>Low End Vibration for Gameplay and App Alerts
>2 Motorized Circle Pads for Haptic Feedback
>Thumbprint Security Scanner with Pulse Sensing Feedback
>2 1mp Stereoptic Cameras
>Multi-Array Microphone
>A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
>3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
>NFC Reader
>3G Chip with GPS Location
>Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
>16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
>Nintendo 3DS Cart Slot
>SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
>Mini USB I/O
>3300 mAh Li-Ion battery

FUSION TERMINAL

GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
>802.11 b/g/n Wireless
>Bluetooth v4.0 BLE
>2 USB 3.0
>1 Coaxial Cable Input
>1 CableCARD Slot
>4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
>Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
>1 HDMI 2.0 1080p/4K Port
>Dolby TrueHD 5.1 or 7.1 Surround Sound
>Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
>Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.

Those come from Gaminrealm, which also quotes one unnamed source stating - in an incredibly garbled manner: 

"“Nintendo has already begin making demo software for the targeted prototype hardware in efforts to curb the Wii U mistake in the software pipeline (they started creating software after prototyping and were unable to give major software push the first two years as a result). Nintendo plans to make most of the software prototypes into games and applications around the launch of the unit.”

interesting wonder what the reasoning behind the bolded is



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kirby007 said:
Suke said:

http://spong.com/article/31220/Nintendo-Next-Gen-Specs-Leaked

 

And so these specs and more have emerged in not one but two units called Nintendo Fusion DS and Terminal. Yes, that was the name of the Nintendo lead rock tour in the 2000s. So, what are those specs? 

FUSION DS

CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
>2 130 mm DVGA (960 x 640) Capacitive Touchscreen
>Slide Out Design with Custom Swivel Tilt Hinge
>Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
>Low End Vibration for Gameplay and App Alerts
>2 Motorized Circle Pads for Haptic Feedback
>Thumbprint Security Scanner with Pulse Sensing Feedback
>2 1mp Stereoptic Cameras
>Multi-Array Microphone
>A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
>3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
>NFC Reader
>3G Chip with GPS Location
>Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
>16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
>Nintendo 3DS Cart Slot
>SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
>Mini USB I/O
>3300 mAh Li-Ion battery

FUSION TERMINAL

GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
>802.11 b/g/n Wireless
>Bluetooth v4.0 BLE
>2 USB 3.0
>1 Coaxial Cable Input
>1 CableCARD Slot
>4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
>Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
>1 HDMI 2.0 1080p/4K Port
>Dolby TrueHD 5.1 or 7.1 Surround Sound
>Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
>Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.

Those come from Gaminrealm, which also quotes one unnamed source stating - in an incredibly garbled manner: 

"“Nintendo has already begin making demo software for the targeted prototype hardware in efforts to curb the Wii U mistake in the software pipeline (they started creating software after prototyping and were unable to give major software push the first two years as a result). Nintendo plans to make most of the software prototypes into games and applications around the launch of the unit.”

interesting wonder what the reasoning behind the bolded is


It does seem odd, I suppose DDR4 will still be pricey so cutting it with DDR3 might save some cash, but then if that's the case then GDDR5 might be a better option. Either way I'm not sure that's enough if 4BONE have 8GB, unless you somehow plug the handheld in for co-processing, but by next gen RAM requirements may have risen further so parity may not be the best option



Just wondering, but how reliable has this source been in the past? I don't know anything about them, so their track record would be useful for knowing whether to take this seriously or treat it as just another random rumour.



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Yeah, not sure if I can believe that we would actually have such detailed specs leaked so early. Especially given that it's Nintendo.



Even if this is true their next system wont hit the selves from three years from now on.



Hmm... There is no way they are thinking to abandon the wiiU even if that thing is a shit ton stronger... But the issue is, if this is their next gen (by that I mean if they release it after 3+ years)... Then it will be considered weak by then... But the 3ds one looks more like a beast since thats a 64 bit cpu

Plus its anonymous so I don't think this is close to being real or maybe they are just experimenting cause I am sure they are starting to think about their next one



                  

PC Specs: CPU: 7800X3D || GPU: Strix 4090 || RAM: 32GB DDR5 6000 || Main SSD: WD 2TB SN850

Fake.

Nintendo wouldn't have such specs or suppliers nailed down this early.

The specs read like a dream wishlist, especially the "DDR4".



The console is using a weakened R9 290x level GPU with DDR4 memory? Sounds like it's gonna be expensive, then. I'm not convinced.



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