Pemalite said:
3D chip stacking started out with stacked DRAM, then NAND. Now we are doing it with Stacked cache on top of CPU cores.
The next jump will be stacked chiplets. - Yeah it will be a challenge, but so was chiplets once upon a time.
Stacked chips though can actually get around the limited latency and bandwidth issues of Fabric interconnects, so there are inherent benefits... Imagine current Ryzen chips, using the same fabrication, but consuming 50% LESS power than they do currently by stacking the chiplets. (That's how much energy is wasted on the fabric.)
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I don't disagree that it will eventually be the way to go, just that chiplet will be less of a challenge and become viable first as a mid-step, perhaps even in consumer-grade GPUs. Infinity Link has a thousand times more bandwidth than either Crossfire or SLi, so I'm sure engineers can find a way around any lingering latency issue.
That or most people will be streaming games within ten years or so, so multi-chip GPUs become more desirable to the industry players anyway.
