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hinch said:
eva01beserk said:

Well sure. Just not to the extreme the guy made it out to be. He pulled the ssd out and said it burned him. I'm sure he was exagerating. 

A piece of electronics drawing 180-190W (on average according to previews) is going to produce some heat. I saw the video and the guy pull the SSD straight from the console and proceeds to touch the heatsink lol.. its going to be hot man xD

I'd imagine this is a non issue unless you totally block off the top ventilation. Unless there's mass reports of retail units overheating or failing there isn't much to speculate about other than it it produces hot air. Which should be expected from these 300w+ console.

It is a non-issue. It's by design.

eva01beserk said:
hinch said:

A piece of electronics drawing 180-190W (on average according to previews) is going to produce some heat. I saw the video and the guy pull the SSD straight from the console and proceeds to touch the heatsink lol.. its going to be hot man xD

I'd imagine this is a non issue unless you totally block off the top ventilation. Unless there's mass reports of retail units overheating or failing there isn't much to speculate about other than it it produces hot air. Which should be expected from these 300w+ console.

Dont think anybody expects any issue like red ring of death 2.0. Just people taking it to an extreme. The worst I see hapening is maybe a fan runing loud and even that is unlikely.

The RROD cannot occur with the 8th gen or 9th gen devices, long before failure can occur the consoles will throttle their clockspeeds and if that isn't enough, enter thermal shutdown to protect the hardware.

It's a PC technology, it's been around for decades now, it works.

AsGryffynn said:

Solder comes before temperature stress tests, not after. Otherwise, the non defective units would have had a different design. OTOH, other components might have had poor heat tolerance and also needed replacing. 

Simply put, the issue wasn't cooling the console so much as making sure it would work at that temperature. Cooling problems imply fan failure or mechanical issues slowing heat exchange. 

Metal expands and contracts with heat. - This is basic thermodynamics. (But I wouldn't know anything about heat, would I?)
The solder would expand and contract with the heat and start to produce fine hair-line cracks, which is why people would cover their Xbox in a towel in order to bring the heat level up high enough to "reset" the solder, but that was only a temporary solution.

It is because the solder wasn't designed to tolerate those heat levels like the older lead solder. - That is down to the cooling design in the Xbox 360 not being up to snuff and the materials being used.

The PCB would also "warp" and buckle compounding the solder issue over time, again, poor thermal design and poor supports.

The same issue would occur on the PC, some older GPU's would have the PCB flex over time, newer GPU's now come with a GPU back-plate which keeps the PCB torqued and as straight as possible.
The older Geforce GPU's would also have the solder joints fail due to heat stresses over time as well, which forced nVidia to do a recall, it's the same issue the Xbox 360 had ironically.
https://www.cnet.com/news/summarizing-the-nvidia-problems-with-laptop-chips-overheating/
https://techreport.com/news/15720/chip-failures-nvidia-responds-at-last/






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