NeoGAF posters were talking about the possibility of an intergrated power brick INSIDE the X360, as opposed to the beast on the outside, due to the fact the 65nm consumes less power overall.
Also, some have argued that the powerbrick (or the surge protectors that consumers attach to the bricks) are also causing RROD's. A new intergrated PB might also help a bit.
So we have:
65nm for cooler, more efficent operation w/ less consuming power
New more powerful heatsink
Intergrated power supply.
All of which should be in prod. by EOY. IMO, the 65nm WILL ABSOLUTELY be implemented by H3s release. By that time, sales of the 360 should pick up, and MS needs the new 360s to ship with the 65nm so they can make more money per system (and also have the new ones to be more reliable).
Back from the dead, I'm afraid.
