Sony might be useing 3D stacked chips to be more power effecient, have better cooling.

[Pemalite]

Immersiveunreality said:

Pemalite said:

The capabilities of Sony's engineers aren't in question.
But there is a reason why we have only done cooling a certain way for decades.

I'm sure there is but maybe the innovation can lie within a more efficient way to implement it,but we are discussing ghosts at the moment so it might be just best to see what they bring.

That is my entire argument though. It's a patent, we don't know if it's actually part of a real product or if it's even effective and thus we should take a "wait and see approach".