Sony might be useing 3D stacked chips to be more power effecient, have better cooling.

[mjk45]

Pemalite said:

Immersiveunreality said:

If it is a ''special sauce'' or not remains to be seen when it's actually used and thoroughly tested after release to determine whether or not it makes a proportionate enough difference to be considered that,it could be a good evolution for PS hardware.(there are probably not even certain comparisons to be made in order to refute those being ''overly'' optimistic about it)

Bolded:The team behind this hardware most likely know it a lot better than assumingly most if not all the users on this site and it would be unlike them to not be considering those aspects in this new project.

The capabilities of Sony's engineers aren't in question.
But there is a reason why we have only done cooling a certain way for decades.

You are correct, we have seen cooling handled mainly by heatsinks and airflow , but it is obvious that we have arrived at a point where the manufacturers even when taking into consideration the improved thermals we see with each gen are feeling that the time as come too look at not so much alternative cooling solutions but adding additional cooling methods in conjunction with traditional cooling, Ms's use of vapour chambers illustrates the start of that trend and their approach of dividing the chipset with a large heatsink is a continuation of looking at novel solutions than just more of the same just bigger and stronger.