Sony might be useing 3D stacked chips to be more power effecient, have better cooling.

[Pemalite]

xl-klaudkil said:

Moren said:

Implying that somehow Microsoft's design wasn't "planned" or innovative is a pretty bold claim, considering they've talked extensively about how they'll handle cooling - they're just going for intricate mechanical designs, which are time-tested and effective.

https://twitter.com/xbox/status/1239522130196193285?lang=en

https://www.youtube.com/watch?v=7Fjn4GRw8qE

Ofcourse because the top of the xbox series x is open for air,so much dust is going to be collected i suspect where going to see a lot of broken systems.

Or not.

"Or not" is the accurate answer.

Because Microsoft and Sony are adopting PC technology, namely PC technology from AMD... They also adopt all the benefits that go with that.

Now since the Pentium 4/Athlon 64, Intel and AMD have implemented overheating protecting in all their processors... That means when you hit the thermal limits of the chips, the chips either throttle downwards in voltage and clockrate or shut off entirely in order to protect themselves, aka. Thermal protection.

The 7th gen consoles missed out on this technological development because they used IBM processors... And that impacted on their reliability to various extents.

The 8th gen consoles do feature the technology, I am sure someone on this forum has seen the error message when their console has hit the thermal limits.

Either way... Microsoft and Sony will have developed the Xbox Series X and Playstation 5 with enough headroom to account for dust accumulation which will reduce the consoles ability to dissipate heat effectively over periods of years, Microsoft's engineering is much much better than it used to be, the Xbox One S and Xbox One X, Microsoft Surface and more is a testament to that very fact.

Either-way, it will be a non-issue for either company/console... Or at the very least an issue that can be rectified with some compressed air once every few years.