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JRPGfan said:

Im gonna go ahead and say I'm impressed.

They are patents. They aren't actual products.
Don't be impressed when there is no demonstrable product yet.

JRPGfan said:


Sony seems to be doing alot of "new" things.
The variable clock speeds, to maximise performance without needing to waste anything on overhead.
The 3D stacked chip, and the unique cooling solution seem, like something we've heard of would be comeing in the future, but no one really expected to see anytime soon.

Variable clockrates that aren't developer controlled/influenced isn't a good thing...

JRPGfan said:

The 3D stacked chip, and the unique cooling solution seem, like something we've heard of would be comeing in the future, but no one really expected to see anytime soon.

We have been stacking NAND chips for years.

JRPGfan said:


Even the controller is new, its no longer called a dualshock, but now the dualSense, after the changes it got in tech.

Controller is just an evolution of past designs, it's different, but it's not going to be playing games any differently, it still has your normal array of buttons and two analogue sticks and a d-pad.

JRPGfan said:


This ontop of stuff like all the work they put into removeing bottlenecks, when moveing data around (from the SSD).

Please elaborate on those bottlenecks.

JRPGfan said:


Alot of this stuff just "seems" more planned out than what Microsoft did.
With the Xbox series X, there wasnt any "surprises", it was basically just more or less what everyone thought it would be.
With the Playstation 5, there seems to be alot of elegant solutions, and new stuff/thinking.

Seems? Elegant solutions? We haven't even seen the console yet!
It's all well and good to use buzzwords to hype something up, but don't use them before we have even seen the hardware.

JRPGfan said:
Moren said:

Thank you Sony for inventing 3D IC stacking!

Sarcasm I take it?... but how many other consumer products do you know that use it currently? Do you see other CPU or GPU solutions that do so?
How many other products do you see a 3D stacked chip cooled on both side? I've never seen that before.

Chip stacking has a ton of caveats... And like you alluded to, cooling is a big one... Implementing an additional cooling layer between stacked chips increases complexity and reduces yields and is entirely unnecessary in scenarios where you have enough space (I.E. PC and Console) when you can simply go the chiplet route and interface those chips with a larger and more efficient surface area to draw heat from. - Basic thermodynamics comes into play.

However 3D chip stacking isn't new or novel... The PSP from 2004 even had a stacked Toshiba eDRAM chip.

HBM Memory uses an interposer with stacked RAM chips on top.

This isn't a new technology invented by Sony.



--::{PC Gaming Master Race}::--