JRPGfan said: Im gonna go ahead and say I'm impressed. |
They are patents. They aren't actual products.
Don't be impressed when there is no demonstrable product yet.
JRPGfan said:
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Variable clockrates that aren't developer controlled/influenced isn't a good thing...
JRPGfan said: The 3D stacked chip, and the unique cooling solution seem, like something we've heard of would be comeing in the future, but no one really expected to see anytime soon. |
We have been stacking NAND chips for years.
JRPGfan said:
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Controller is just an evolution of past designs, it's different, but it's not going to be playing games any differently, it still has your normal array of buttons and two analogue sticks and a d-pad.
JRPGfan said:
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Please elaborate on those bottlenecks.
JRPGfan said:
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Seems? Elegant solutions? We haven't even seen the console yet!
It's all well and good to use buzzwords to hype something up, but don't use them before we have even seen the hardware.
JRPGfan said:
Sarcasm I take it?... but how many other consumer products do you know that use it currently? Do you see other CPU or GPU solutions that do so? |
Chip stacking has a ton of caveats... And like you alluded to, cooling is a big one... Implementing an additional cooling layer between stacked chips increases complexity and reduces yields and is entirely unnecessary in scenarios where you have enough space (I.E. PC and Console) when you can simply go the chiplet route and interface those chips with a larger and more efficient surface area to draw heat from. - Basic thermodynamics comes into play.
However 3D chip stacking isn't new or novel... The PSP from 2004 even had a stacked Toshiba eDRAM chip.
HBM Memory uses an interposer with stacked RAM chips on top.
This isn't a new technology invented by Sony.
--::{PC Gaming Master Race}::--