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JRPGfan said:
Moren said:

Thank you Sony for inventing 3D IC stacking!

Sarcasm I take it?... but how many other consumer products do you know that use it currently? Do you see other CPU or GPU solutions that do so?
How many other products do you see a 3D stacked chip cooled on both side? I've never seen that before.

As for 3D stacking, that has been used commercially since the PSP. Today it's mostly used in SSDs and other storage technologies.

As for cooling from both sides, neat little trick but basically not necessary at all. It's really just a design decision depending on your case layout. And they would be only able to do it because they have guaranteed 10s of millions of sold units. Otherwise it's really not economically viable.

Last edited by vivster - on 23 April 2020

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