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JRPGfan said:
Moren said:

Thank you Sony for inventing 3D IC stacking!

Sarcasm I take it?... but how many other consumer products do you know that use it currently? Do you see other CPU or GPU solutions that do so?
How many other products do you see a 3D stacked chip cooled on both side? I've never seen that before.

Implying that somehow Microsoft's design wasn't "planned" or innovative is a pretty bold claim, considering they've talked extensively about how they'll handle cooling - they're just going for intricate mechanical designs, which are time-tested and effective.

Last edited by Moren - on 23 April 2020