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haxxiy said:
HollyGamer said:

Aquazhi from Taiwanese forum who has been leaked info and said Xbox X (Scarlet Arden) die chip is around 350 mm and Oberon PS5 chip is 300 mm is proven bogus and fake. SO the number of PS5 using 40 CU and small die chip size  cannot be used as fact. Even the 36 CU figure from Github are not confirmed to be on PS5 chip and the of the test date are very very old.  

Or he's just not that good at measuring stuff. The Arden chip itself has been estimated from 340 - 410 mm2 according to various sources, or even an outlandish 570 mm2. Small differences on perspective correction and distortion, or using the wrong sort of capacitors as an anchor (such as the 570 mm2 estimate did) can cause this. That's why these things are educate estimates at best.

it's big difference between 350 mm2 to 410 mm2. And also it's impossible to measure the die size by just looking at them directly more so on comparing Oberon and Arden. AMD division who work on Sony has separate division with the one who worked with Microsoft.