Pemalite on 06 March 2019
| Nate4Drake said: Question for Pemalite : what about TSMC Wafer-on-Wafer 3D Stacking Technology ? Any chances it can be implemented for future GPU in 2020/2021 ? |
I think for Next-Gen consoles... They are more than likely to go the monolithic SoC approach... Or the Multi-Chip approach with fabric binding them together.
Wafer on Wafer is still a fairly new concept and could be a bit of a risk... I know Intel is looking into taking on the idea with it's future chips to counter AMD'S chiplet approach, so it will be interesting to see where things go... But considering the industry hasn't pushed 7nm to it's limits yet, there is no rush to jump on that technology just yet.
For a mid-generation console upgrade though, I wouldn't be surprised if they leveraged it.
--::{PC Gaming Master Race}::--
