Pemalite said: Indeed. I think AMD's approach to building smaller chips to bolster yields and then using their fabric to get them working together might be the key approach going forward with smaller geometries. |
Personally, I'm most interested in the progress of EUV especially in Samsung's case where they just had breakthrough with their custom in-house EUV mask solution so I hope to see some Snapdragon 855 with integrated 5G modems will out for sale by the end of 2018 ... (a year ahead of everybody in deploying this new scanner technology)
Once EUV is out the door we can look forward to a new change in transistor structure like their proprietary GAAFETs (gate all around) known as MCBFETs (multi-channel bridge) from FinFETs by the end of 2021 ...
Samsung is starting to become more and more like what Intel was than the current Intel ...