fatslob-:O said:
I think that might be AMD/Sony's plan, to build next generation infinity fabric so that they can build these APU "chiplets" then connect them on a high speed on-die interconnect so that they can roll their previously failed vision (HSA) into their new work and get cost savings for producing smaller dies like they do for their Threadripper or EPYC platform ... |
Indeed. I think AMD's approach to building smaller chips to bolster yields and then using their fabric to get them working together might be the key approach going forward with smaller geometries.
We are at an exciting point in the semiconductor industry, there are a heap of different ways things could go and I am keen to see it all play out.
--::{PC Gaming Master Race}::--