Pemalite said:
CrazyGPU said:
There are no many shrinks left and each of them are harder and more expensive. |
Ironically... NAND/DRAM has side stepped this issue for the time being, you should look at what they are doing.
Some NAND manufacturers even started producing their NAND at 55nm rather than say... 14nm. And the chips were smaller and offered more capacity.
CrazyGPU said:
They need new materials, they are studying silicon replacement, they are getting near molecular size, they have more quantum mecanic problems, machinery in fabrics are becoming exponentially expensive. They should get arround it but it will take more time than ever to make a justifiable PS6. |
Or. If you can't go smaller... You go with bigger geometry sizes and you go taller like NAND/DRAM.
AMD took note of how die shrinks are starting to stall out... And took advantage of that with Ryzen. So instead of making one giant monolithic chip to rule them all... They took smaller chips that are cheaper to manufacture and stitched them together... And because the chips are smaller, they get more workable chips per wafer.
What you are stating isn't intrinsically wrong, but there are tons of ways to get around the problem that manufacturers are looking at.
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I didn´t say they are not going to do it or get arround the problem going vertical or with different elements or whatever. Im just saying that it will be expensive and that it will take time. Look at Bandwith for example. How old is HBM? HBM2 is great, but it is expensive, hard to find and implemented only in a few cards. New way of doing stuff takes time and money. That is another reason why PS5 will have a long lifecicle.
