| Bofferbrauer2 said: It's not even ready yet for volume production and keeps getting pushed back. Right now Volume production is slated to start around 2019/2020 (Intel for 1919, Globalfoundries, TSMC and Samsung for 2020), though even then the WPH (wafers per hour) rate is pretty low at less than 100 compared to almost 300 for 193nm immersion lithography. What'smore is it's still about 20% more expensive to run than thraditional 193nm lithography, which compounded with the low output makes it very expensive. It's far from amortized, the big Fabs don't even have EUV ready yet. It's possible that you confuse it with DUV, which is Deep Ultraviolet Lithography and the 193nm processes actually in use (Ultraviolet starts at around 350nm already) by all the Fabs right now. |
Actually Samsung will use EUV in 2018 with their 7nm process technology ... 
And I'm not confused, far from it ... 
Also the wafer throughput has been increased 125 WPH with ASML's NXE:3400B ...
| Bofferbrauer2 said: Even then, from the roadmap of Globalfoundries I can see that EUV will only be used in Conjunction with DUV, and the reason is to reduce the multiple patterning necessary with 193nm. For 7nm for instance, you'll need 4 mask patterns without EUV, which is pretty complex and prone for errors. It also depends if ASML can actually deliver the necessary EUV Lithography devices, as they are the sole producer of them. But they just reduced the outlook for 2017 from 12 machines to only 6-7. They shipped a grand total of 20 EUV Lithography machines in the years 2010-2016, compared to 60 DUV in 2016 alone. |
That's cause Global Foundries is full of goofs ...
ASML also shipped 3 NXE:3400B systems last quarter with 8 additional orders of which 6 came from one customer for use in for both logic and DRAM ... (it's obviously Samsung)
