| fatslob-:O said: No it isn't ... Samsung's spec for their 7nm is noticeably better than Intel 10nm ... Samsung's 10nm isn't even their true successor to 14nm, that lies with 7nm which will give it over a 2x shrink. GF outing Samsung in the density race ? Fat chance of that happening since we know what happened last time on 14nm ... Throwing tons of money actually does seem to work considering how capitally intensive modern integrated manufacturing is. The only reason why GF is even remotely competitive with TSMC despite being much smaller is because they get free lunches from IBM and Samsung ... EUV will have low yields ? LOL wut is this ? EUV is just a change to the scanner, if anything EUV should have better yields because of it's higher resolution imaging ... |
Samsung claimed a SRAM size of 0.030 um², CCP of 44 nm and MMP of 36 nm on their proposed roadmap. Intel's 10 nm has a SRAM size of 0.031 um², CCP of 54 nm and MMP of 36 nm. It's unknown if they will even come close to these since we know their newer, proposed 5 nm demoed alongside IBM a few weeks back has a CCP of 48 nm (coupled possibly with a rather agressive gate scaling).
Obviously no upcoming technology and the ones sponsoring it are going to make a presentation claiming it's going to be worse. EUV has a couple of theoretical advantages, but it's extremely complex and expensive to get it right - so, time and time again, for years now, another lithographic technology was preferred over implementing EUV.
Both TSMC's 10 nm and GloFo's 7 nm are denser than Samsung's 10 nm. It's just a question of whether GloFo can get it to the market before Samsung's 8-7 nm manage to do on H2 2019 at earliest. GloFo had 32 nm and 28 nm ready before Samsung, anyway, not to mention Samsung is following a different path this time around, improving their 10 nm design, so I'm not sure why you are so offended by the possibility GloFo manages to have a denser node for a year or so.
Besides, do try to do with less teenage internet slang and passive-agressiveness and more arguments the next time around, otherwise I'm going to assume you don't know much about what you are talking about, and not even bother to discuss.
