| haxxiy said: Intel's process is 14 nm, or at least has a legitimate reason to call itself so. It beat the ITRS rules for 16 nm. It will be behind with their 10 nm, but still, that will be the most complex and dense node on the market for years to come. There is very likely no Samsung 7 nm process before 2020 at least, since they just released the first generation of 10 nm and pretend to have three of them, before moving to 8 nm on DUV by 2019, and only after then 7 nm. http://www.anandtech.com/show/11337/samsung-and-tsmc-roadmaps-12-nm-8-nm-and-6-nm-added/ Hell, Samsung took three years to release a "10 nm" node barely more dense than Intel's 14 nm, which has almost no interested buyers so far besides themselves and some Snapdragon from Qualcomm (a design desperate to be competitive again), and very likely worse electric properties than Intel's 14 nm, since Intel can afford to sacrifice transistor density to have so. Global Foundries and TSMC are much closer in density to Intel's 10 nm with their "7 nm" DUV processes, albeit still a little behind, and probably will beat Samsung's 8 nm to the market. Throwing tons of money at something doesn't mean your product will come ahead of more experienced and equally clever competitors. Ask that to IBM. Besides, I have a hunch that EUV processes will have to deal with low yields and high costs for a while, so I wouldn't be surprised if they were stuck on risk production for some 2 years or so. Intel seems to agree, since there will be no true 7 nm from them until 2021-2022. DUV will probably be the way to go on the 2018-2021 timeframe. |
No it isn't ...
Samsung's spec for their 7nm is noticeably better than Intel 10nm ...
Samsung's 10nm isn't even their true successor to 14nm, that lies with 7nm which will give it over a 2x shrink. GF outing Samsung in the density race ? Fat chance of that happening since we know what happened last time on 14nm ...
Throwing tons of money actually does seem to work considering how capitally intensive modern integrated manufacturing is. The only reason why GF is even remotely competitive with TSMC despite being much smaller is because they get free lunches from IBM and Samsung ...
EUV will have low yields ? LOL wut is this ? EUV is just a change to the scanner, if anything EUV should have better yields because of it's higher resolution imaging ...
