fatslob-:O on 26 June 2017
| Pemalite said: The irony is that Intel used multiple dies "stitched together" multiple times. The Yorkfield based Quad-core chips (Xeons included) being a Prime example where Intel "stitched together" two dual core chips. Same went with Clovertown, Harpertown and Tigerton. So they aren't speaking from ignorance. Although AMD's interconnect "Mesh" is substantially more advanced than anything Intel used when dealing with multiple dies on a single substrate. With that, Intel is in full damage control at the moment. And for good reason. Ryzen/Epyc is beastly and consumers are eating them up. |
Needs more frequency and timing optimizations. With Zen 2 I think AMD will be golden ...
AMD should stop investing some more in the original Zen and treat that as an experiment that went horribly good like Intel's knights Corner line and start focusing on pushing out Zen 2 by 2H 2018 ...
It'll be the greatest day for AMD If Zen 2 can hit 5 GHz, support AVX-512 (like Skylake-X/SP) and TSX while getting some IPC improvements when we can finally put Pentiums, Celerons and i3's on death row or at least reform them ...
If AMD can do all that then they also need to get globalfoundries shit together with high wafer supply to be able to flood the markets wih sub $100 high performing Zen 2 CPUs like China or other developing regions ...
