Pemalite on 26 June 2017
The irony is that Intel used multiple dies "stitched together" multiple times. The Yorkfield based Quad-core chips (Xeons included) being a Prime example where Intel "stitched together" two dual core chips.
Same went with Clovertown, Harpertown and Tigerton.
So they aren't speaking from ignorance.
Although AMD's interconnect "Mesh" is substantially more advanced than anything Intel used when dealing with multiple dies on a single substrate.
With that, Intel is in full damage control at the moment. And for good reason. Ryzen/Epyc is beastly and consumers are eating them up.
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